Additions of organic species to facilitate crosslinker removal during PSPI cure
US9740101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2015 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Nov 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/293
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.