High aspect ratio structure analysis
US9741536B2 · kind B2 · utility
4Cited by
10References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 4, 2013 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Oct 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Curtaining artifacts on high aspect ratio features are reduced by reducing the distance between a protective layer and feature of interest. For example, the ion beam can mill at an angle to the work piece surface to create a sloped surface. A protective layer is deposited onto the sloped surface, and the ion beam mills through the protective layer to expose the feature of interest for analysis. The sloped mill positions the protective layer close to the feature of interest to reduce curtaining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.