Method for surface treatment of upper electrode, plasma processing apparatus and upper electrode
US9741540B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 15, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Apr 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32862
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a method for surface treatment of an upper electrode, a first step is performed to roughen a facing surface of the upper electrode facing a lower electrode while depositing a CF-based deposit on the facing surface by using a plasma of a processing gas by supplying a first and second high frequency powers to the lower and upper electrode. A second step is performed to remove a part of the CF-based deposit by using a plasma of a processing gas by supplying the second high frequency power to the upper electrode only, and a third step is performed to remove the CF-based deposit remaining in the second step by using a plasma of a processing gas by supplying the first and second high frequency powers to the lower and upper electrode. Further, the first, second and third steps are repeated multiple times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.