Patent · US Active

Method of forming mark pattern, recording medium and method of generating mark data

US9741564B2 · kind B2 · utility

0Cited by
1References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 30, 2015
Grant dateAug 22, 2017
Priority date
Expiry dateJul 30, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/2002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a method of forming a mark pattern according to the embodiments, a film to be processed on a substrate is coated with a photosensitive film, and the photosensitive film is irradiated with exposure light via a mask. On the mask, a first circuit pattern having a first transmittance and a mark having a second transmittance and used to measure a superposition between films are arranged. By irradiating with the exposure light, a second circuit pattern having a first film thickness and a mark pattern having a second film thickness thinner than the first film thickness are formed on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.