Desmear with metalized protective film
US9741606B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49827
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments herein may relate to a technique for generating a via in a substrate. Specifically, the technique may include coupling a polyethylene terephthalate (PET) layer, a protective metal layer, and a build-up layer to a metal layer. The process may further include etching a via in the PET layer, the protective metal layer, and at least a portion of the build-up layer. The process may further include performing a plasma desmear process on the substrate and then peeling the PET layer to remove the PET layer and the protective metal layer. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.