Device packaging facility and method, and device processing apparatus utilizing phthalate
US9741683B2 · kind B2 · utility
1Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Jul 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.