Redistribution layers in semiconductor packages and methods of forming same
US9741690B1 · kind B1 · utility
33Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment package includes a first integrated circuit die, an encapsulent around the first integrated circuit die, and a conductive line electrically connecting a first conductive via to a second conductive via. The conductive line includes a first segment over the first integrated circuit die and having a first lengthwise dimension extending in a first direction and a second segment having a second lengthwise dimension extending in a second direction different than the first direction. The second segment extends over a boundary between the first integrated circuit die and the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.