LED module having LED element connected to metal layer exposed by opening in multi-layer resist
US9741915B2 · kind B2 · utility
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Key dates
| Filing date | Jul 27, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Jul 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.