Circuit substrate and manufacturing method thereof
US9744745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Jan 20, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31518
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.