Systems and methods for enhancing inspection sensitivity of an inspection tool
US9747520B2 · kind B2 · utility
4Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Mar 11, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.