Substrate treatment apparatus and substrate treatment method
US9748091B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 26, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Aug 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a substrate treatment apparatus includes a housing configured to house a substrate. The apparatus further includes a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent. The apparatus further includes a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.