Semiconductor devices with impedance matching-circuits
US9748185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Feb 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of semiconductor devices (e.g., RF devices) include a substrate, an isolation structure, an active device, a lead, and a circuit. The isolation structure is coupled to the substrate, and includes an opening. An active device area is defined by a portion of the substrate surface that is exposed through the opening. The active device is coupled to the substrate surface within the active device area. The circuit is electrically coupled between the active device and the lead. The circuit includes one or more elements positioned outside the active device area (e.g., physically coupled to the isolation structure and/or under the lead). The elements positioned outside the active device area may include elements of an envelope termination circuit and/or an impedance matching circuit. Embodiments also include method of manufacturing such semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.