Scott D. Marshall
10Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: May 30, 2003 → Apr 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9673162B2 | High power semiconductor package subsystems | Electricity | 7 | Active |
| US9281283B2 | Semiconductor devices with impedance matching-circuits | Electricity | 4 | Active |
| US6982483B2 | High impedance radio frequency power plastic package | Electricity | 4 | Expired |
| US9748185B2 | Semiconductor devices with impedance matching-circuits | Electricity | 2 | Active |
| US11621673B2 | Power amplifier packages and systems incorporating design-flexible package platforms | Electricity | 2 | Active |
| US11342275B2 | Leadless power amplifier packages including topside terminations and methods for the fabrication thereof | Electricity | 1 | Active |
| US11984429B2 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Electricity | 1 | Active |
| US10211177B2 | High power semiconductor package subsystems | Electricity | 0 | Active |
| US11621231B2 | Methods of fabricating leadless power amplifier packages including topside terminations | Electricity | 0 | Active |
| US11049837B2 | Bond wire array for packaged semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.