Printed circuit board and semiconductor package using the same
US9748193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Aug 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09909
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.