Thermal compression bonding process cooling manifold

US9748199B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Hemanth K. Dhavaleswarapu · Chandler, US
• Zhihua Li · Changsha, CN
• Joseph B. Petrini · Gilbert, US
• Steven B. Roach · Gilbert, US
• Shankar Devasenathipathy · Tempe, US
• George Kostiew · Chandler, US
• Amram Eitan · Scottsdale, US

Key dates

• Filing date: Mar 7, 2016
• Grant date: Aug 29, 2017
• Expiry date: Mar 7, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1121
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.