Integrated circuit packaging system with conductive pillars and method of manufacture thereof
US9748203B2 · kind B2 · utility
2Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2011 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | May 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.