Optical measurement of lead angle of groove in manufactured part
US9752868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2016 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Oct 8, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A portion of the surface of a cylindrical part with a machined groove is mapped with an optical profilometer during the manufacturing process and the height map is fitted to a virtual cylindrical configuration that best fits the data. Two-dimensional Fourier Transfer analysis of the map data is advantageously used to find the orientation of the groove on the part. The orientation of the groove is then compared to the longitudinal axis of such virtual cylinder to calculate the groove's lead angle. If the measured lead angle is outside a predetermined design tolerance deemed acceptable for manufacturing purposes, the part is removed from the fabrication line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.