Patent · US Active

Wafer inspection method and software

US9754365B2 · kind B2 · utility

1Cited by

3References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Asaf Schlezinger · Sunnyvale, US
Markus J. Stopper · Hergolding, DE

Key dates

Filing date	Jan 30, 2015
Grant date	Sep 5, 2017
Priority date	—
Expiry date	Nov 15, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG06T2219/2012
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.