Component-mounted structure
US9756728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2013 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Jul 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0465
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.