Polyamide molding compositions, molded parts obtained therefrom, and use thereof
US9758673B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide molding compositions, use thereof, and molded parts obtained therefrom Provided is a polyamide molding composition comprising a) at least one semi-crystalline polyamide; b) at least one thermoplastic polyester; c) at least one novolac resin; and d) at least one flat glass fibers as filler, and optionally e) at least one amorphous polyamide and f) at least one additive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.