Patent · US Active

Polishing slurry and substrate polishing method using the same

US9758698B2 · kind B2 · utility

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18Claims
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Assignee

Inventor

Key dates

Filing dateMar 17, 2016
Grant dateSep 12, 2017
Priority date—
Expiry dateMar 17, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/28079
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Provided are slurry for polishing cobalt and a substrate polishing method. The slurry includes an abrasive configured to perform the polishing, the abrasive comprising zirconium oxide particles, a dispersing agent configured to disperse the abrasive, and a polishing accelerator configured to accelerate the polishing. The polishing accelerator includes an organic acid containing an amine group and a carboxylic group. According to the slurry in accordance with an exemplary embodiment, a polishing rate of the cobalt may increases without using an oxidizing agent, and local corrosion defects on a surface of the cobalt may be suppressed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.