Patent · US Active

Closed loop control

US9758855B2 · kind B2 · utility

4Cited by

3References

17Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Thomas DEPPISCH · Aschaffenburg, DE
Franz-Josef Helle · Rodenbach, DE
Manfred Englert · Niederrodenbach, DE
Uwe Hermanns · Seligenstadt, DE

Key dates

Filing date	Nov 30, 2011
Grant date	Sep 12, 2017
Priority date	—
Expiry date	Jan 23, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of controlling a reactive deposition process and a corresponding assembly and/or apparatus are described. The method includes providing power to a cathode with a power supply, providing a voltage set point to the power supply, receiving a power value correlating the power provided to the cathode, and controlling a flow of a process gas in dependence of the power value to provide a closed loop control for the power value.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.