Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby
US9758889B2 · kind B2 · utility
4Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 8, 2014 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Mar 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.