Pattern forming method and actinic-ray- or radiation-sensitive resin composition
US9760003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2011 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | May 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a method of forming a pattern and an actinic-ray- or radiation-sensitive resin composition that excels in the limiting resolving power, roughness characteristics, exposure latitude (EL) and bridge defect performance. The method of forming a pattern includes (1) forming an actinic-ray- or radiation-sensitive resin composition into a film, (2) exposing the film to light, and (3) developing the exposed film with a developer containing an organic solvent. The actinic-ray- or radiation-sensitive resin composition contains (A) a resin containing a repeating unit with a structural moiety that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid, and (B) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.