Semiconductor device
US9761527B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Aug 1, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Aug 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B41/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first regions including non-conductive material layers and a plurality of second regions including conductive material layers, wherein the first regions and the second regions are alternately arranged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.