Semiconductor package, semiconductor device using the same and manufacturing method thereof
US9761534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | May 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer. The first electronic component is disposed above the second conductive layer of the package substrate. The second package body encapsulates the first electronic component and the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.