Electronic component package with multple electronic components
US9761570B1 · kind B1 · utility
2Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an electronic component package from an encapsulated panel. The encapsulated panel includes two packaging substrate assembles including electronic components. Access sides of the electronic components face outward from the encapsulated panel. Standoffs separate the packaging substrate assemblies from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.