Chip on board type LED module
US9761766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Feb 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.