Patent · US Active

Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device

US9768120B2 · kind B2 · utility

0Cited by

5References

8Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Philipp Seng · Munich, DE
Khalil Hosseini · Weihmichl, DE
Anton Mauder · Kolbermoor, DE

Key dates

Filing date	Nov 21, 2012
Grant date	Sep 19, 2017
Priority date	—
Expiry date	Oct 29, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15747
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a chip carrier and a semiconductor die with a semiconductor portion and a conductive structure. A soldered layer mechanically and electrically connects the chip carrier and the conductive structure at a soldering side of the semiconductor die. At the soldering side an outermost surface portion along an edge of the semiconductor die has a greater distance to the chip carrier than a central surface portion. The conductive structure covers the central surface portion and at least a section of an intermediate surface portion tilted to the central surface portion. Solder material is effectively prevented from coating such semiconductor surfaces that are prone to damages and solder-induced contamination is significantly reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.