Removal apparatuses for semiconductor chips
US9768141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Aug 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.