Optoelectronic component and method of producing an optoelectronic component

US9768360B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Michael Fehrer · Bad Abbach, DE
• Alfred Lell · Maxhütte-Haidhof, DE
• Martin Muller · Chicago, US
• Tilman Schlenker · Nittendorf, DE
• Sönke Tautz · Tegernheim, DE
• Uwe Strauß · Bad Abbach, DE

Key dates

• Filing date: Sep 14, 2016
• Grant date: Sep 19, 2017
• Expiry date: Sep 14, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.