Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof
US9769554B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 17, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.