Package base, package, electronic device, electronic apparatus, and moving object
US9769934B2 · kind B2 · utility
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0References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 14, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0435
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.