Inventor · Suwa, JP

Tetsuro MIYAO

2Patents
1h-index
4Co-inventors
27Inventor score

Filing activity: Nov 11, 2014 → Jul 14, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US9954160B2 Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object Emerging Cross-Sectional Technologies 3 Active
US9769934B2 Package base, package, electronic device, electronic apparatus, and moving object Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.