Patent · US Active

Method of manufacturing chemical mechanical polishing pads

US9770808B2 · kind B2 · utility

0Cited by

9References

9Claims

0Family size

Assignees

Inventors

Francis V. Acholla · Yardley, US
Andrew Wank · Avondale, US
Mark Gazze · McKeesport, US
Scott Chang · Taipei, TW
Jeff Tsai · Zhunan Town, TW
William A. Heeschen · Midland, US
James D. Tate · Lake Jackson, US
Leo H. Chiang · Pearland, US
Swee-Teng Chin · Pearland, US

Key dates

Filing date	Jan 12, 2016
Grant date	Sep 26, 2017
Priority date	—
Expiry date	Jun 15, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG01N2201/12
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.