Patent · US Active

Device and method for processing of wafers

US9771223B2 · kind B2 · utility

0Cited by

21References

15Claims

0Family size

Assignee

EV Group GmbH · AT

Inventors

Friedrich Paul Lindner · Ried im Innkreis, AT
Peter-Oliver Hangweier · Pram, AT

Key dates

Filing date	Jul 23, 2013
Grant date	Sep 26, 2017
Priority date	—
Expiry date	Oct 19, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/10
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.