Sealant composition for electronic device
US9771500B2 · kind B2 · utility
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1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2016 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Feb 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.