Patent · US Active

Bondable device including a hydrophilic layer

US9773741B1 · kind B1 · utility

11Cited by

2References

30Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Shiqun Gu · San Diego, US
Yang Du · Carlsbad, US
William Xia · San Diego, US

Key dates

Filing date	Aug 17, 2016
Grant date	Sep 26, 2017
Priority date	—
Expiry date	Aug 17, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06548
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus includes a first component layer. The component layer includes a first semiconductor device. The apparatus further includes a first hydrophilic layer and a first hydrophobic layer. The first hydrophobic layer is positioned between the first component layer and the first hydrophilic layer. The apparatus further includes a first contact extending through the first hydrophobic layer and the first hydrophilic layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.