Circuit board and manufacturing method thereof
US9775246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Sep 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. The photo imageable dielectric layer is disposed on the electrical connection area and has a plurality of openings, wherein parts of the first circuit layer is exposed by the openings. The conductive bumps are disposed at the openings respectively and connected to the first circuit layer, wherein a side surface of each of the conductive bumps is at least partially covered by the photo imageable dielectric layer. In addition, a manufacturing method of the circuit board is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.