Chemical mechanical polishing (CMP) composition comprising a protein

US9777192B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Yuzhuo Li
• Bastian Marten Noller · Lorsch, DE
• Michael Lauter · Mannheim, DE
• Roland Lange · Schifferstadt, DE

Key dates

• Filing date: Jan 25, 2013
• Grant date: Oct 3, 2017
• Expiry date: Jan 25, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31053
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.