Polishing method and polishing apparatus
US9782870B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Dec 24, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.