Patent · US Active

Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom

US9783882B2 · kind B2 · utility

5Cited by
198References
24Claims
0Family size

Assignee

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Key dates

Filing dateSep 10, 2014
Grant dateOct 10, 2017
Priority date
Expiry dateJan 31, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/332
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.