Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom
US9783882B2 · kind B2 · utility
5Cited by
198References
24Claims
0Family size
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Key dates
| Filing date | Sep 10, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jan 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.