Double-etch nanowire process
US9783895B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
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Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an aspect of this disclosure, a method is provided comprising the steps of: (a) providing a silicon-containing substrate, (b) depositing a first metal on the substrate, (c) etching the substrate produced by step (b) using a first etch, and (d) etching the substrate produced by step (c) using a second etch, wherein the second etch is more aggressive towards the deposited metal than the first etch, wherein the result of step (d) comprises silicon nanowires. The method may further comprise, for example, steps (b1) subjecting the first metal to a treatment which causes it to agglomerate and (b2) depositing a second metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.