Method and device for determining a lateral offset of a pattern on a substrate relative to a desired position
US9786046B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Dec 28, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30208
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for determining a lateral offset of a pattern on a substrate relative to a desired position with the steps: a) providing a plurality of measurement and simulation images of the pattern with equidistant defocus positions, b) forming a plurality of first and second pairs, which each has a measurement image and a simulation image, wherein each first pair has the same first focal distance and each second pair has the same second focal distance, being different from the first focal distance, of the defocus positions thereof, and determining a first and second lateral distance of the patterns for each first and second pair, respectively, c) determining a first and a second linear fit line based on the determined first and second lateral distances, respectively, and d) determining the lateral offset of the pattern on the substrate relative to the desired position using the linear fit lines of step c).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.