Plasma processing apparatus and method for manufacturing electronic component
US9786472B2 · kind B2 · utility
0Cited by
5References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 2, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus performs plasma processing on a substrate held by a carrier. The carrier includes a frame disposed around the substrate and a holding sheet which holds the substrate and the frame. The plasma processing apparatus includes: a chamber; a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted; a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier; and a plasma exciting unit which generates plasma within the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.