Semiconductor device and manufacturing method thereof
US9786520B2 · kind B2 · utility
4Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Nov 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the present disclosure provide a method of manufacturing a device. The method includes providing a carrier, the carrier including a top surface, covering a portion of the top surface with a plurality of active dies, disposing a protrudent band over a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier, and forming a molding compound over the carrier to cover the plurality of active dies. A method for determining a width of the protrudent band of a device described herein is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.