Planar leadframe substrate having a downset below within a die area
US9786582B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15159
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for encasing in a mold material includes a plurality of interconnected support members. A die pad is connected to the support members and includes a bottom surface. The die pad is configured to receive a die. A downset is connected to the die pad and positioned below the bottom surface. The downset includes at least one wall defining an interior volume for receiving a flow of the mold material to reduce the velocity of the mold material flow through the downset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.