Circuit substrate and package structure
US9786588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a circuit substrate and a package structure. The circuit substrate includes a molding compound having a chip-side surface and a solder ball-side surface opposite from the chip side surface. A first conductive bulk is formed embedded in the molding compound. The first conductive bulk has a first number of first chip-side bond pad surfaces and a second number of first solder ball-side surfaces exposed from the chip side surface and the ball-side surface, respectively. The width of the first conductive bulk is greater than the first width of the first chip-side bond pad surfaces and the second width of the first solder ball-side surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.