Patent · US Active

Dual-side reinforcement flux for encapsulation

US9786629B2 · kind B2 · utility

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9Claims

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Inventors

Ramakrishna Hosur Venkatagiriyappa · Bengaluru, IN
Sutapa Mukherjee · South Plainfield, US
Harish Hanchina Siddappa · Bengaluru, IN
Morgana De Avila Ribas · Bengaluru, IN
Siuli Sarkar · South Plainfield, US
Bawa Singh · Cherry Hill, US
Rahul Raut · Edison, US

Key dates

Filing date	Jul 31, 2014
Grant date	Oct 10, 2017
Priority date	—
Expiry date	Jul 31, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10977
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.