Siuli Sarkar
29Patents
2h-index
51Co-inventors
56Inventor score
Filing activity: Aug 3, 2006 → Oct 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7968008B2 | Particles and inks and films using them | Emerging Cross-Sectional Technologies | 7 | Active |
| US10322471B2 | Low temperature high reliability alloy for solder hierarchy | Electricity | 3 | Active |
| US9802275B2 | Rosin-free thermosetting flux formulations | Electricity | 2 | Active |
| US9217088B2 | Particles and inks and films using them | Emerging Cross-Sectional Technologies | 2 | Active |
| US11162007B2 | Sintering paste | Electricity | 1 | Active |
| US10259980B2 | Sintering powder | Electricity | 1 | Active |
| US10998284B2 | Low pressure sintering powder | Electricity | 1 | Active |
| US9566668B2 | Flux formulations | Electricity | 1 | Active |
| US11193031B2 | Dielectric ink composition | Electricity | 1 | Active |
| US10672531B2 | Stretchable interconnects for flexible electronic surfaces | Electricity | 0 | Active |
| US11830640B2 | Stretchable interconnects for flexible electronic surfaces | Electricity | 0 | Active |
| US10894302B2 | Multilayered metal nano and micron particles | Electricity | 0 | Active |
| US11090768B2 | Lead-free and antimony-free tin solder reliable at high temperatures | Performing Operations; Transporting | 0 | Active |
| US10682732B2 | Engineered polymer-based electronic materials | Electricity | 0 | Active |
| US11929341B2 | Nano copper paste and film for sintered die attach and similar applications | Electricity | 0 | Active |
| US11139089B2 | Stretchable interconnects for flexible electronic surfaces | Electricity | 0 | Active |
| US11389865B2 | Sintering materials and attachment methods using same | Electricity | 0 | Active |
| US10494696B2 | Metal recovery | Emerging Cross-Sectional Technologies | 0 | Active |
| US12278022B2 | Stretchable interconnects for flexible electronic surfaces | Electricity | 0 | Active |
| US12233483B2 | Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications | Performing Operations; Transporting | 0 | Active |
| US10130995B2 | Method for manufacturing metal powder | Electricity | 0 | Active |
| US11411150B2 | Advanced solder alloys for electronic interconnects | Electricity | 0 | Active |
| US12084583B2 | Dielectric ink composition | Electricity | 0 | Active |
| US12115602B2 | Lead-free solder compositions | Chemistry; Metallurgy | 0 | Active |
| US9786629B2 | Dual-side reinforcement flux for encapsulation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.